Vanishing processing service
Leave the processing to us!
At Seiwa Precision Industry Co., Ltd., we perform bushing processing on the sealing parts of semiconductor joints. This technique involves crushing the sealing area with rollers to increase surface hardness and also achieve a mirror finish. Additionally, compared to polished mirror finishes, the higher hardness makes it less prone to scratches and leaks. Please feel free to contact us if you have any requests. 【Other Sales Items】 ■ Lathe Processing ■ Milling Processing ■ Machining ■ Electrolytic Polishing, etc. *For more details, please download the PDF or feel free to contact us.
- Company：清和精密工業
- Price：Other
